MB wafer croping TS 207

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Best cutting quality WITH minimum kerf loss for PV and semiconductor industrIESOur inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Robust construction and easy handling are additional features of the TS 207. The machine is loaded manually with silicon ingots or bricks and offers flexibility of use.The TS 207 is offered in a different layout also for the processing of multicrystalline silicon.High capacityMonocrystalline silicon ingots or bricksFlexible useHigh surface and cutting qualityLowest kerf lossLowest Cost of OwnershipOrientable crystal axisFor processing monocristalline silicon the TS 207 is available in two versions (series 8 and 13). The series 8 allows users to orient the crystal axis to the blade prior to cutting. Due to this, wafers can be cut perfectly parallel to the crystal lattice. This complies with highest demands of the semiconductor industry.

TS 207 - Series 8	TS 207 - Series 13
Application	Semi + PV	PV
Material	Mono Si	Mono Si
Cross sections	ø 100 - 215 mm	ø 150 - 215 mm / ø 125 mm / ø 156 mm
Block length	82 - 2100 mm	300 - 2850 mm
Brick length	50 - 760 mm	120 - 1000 mm
Crystal axis orientation	Yes	No
Operation modes	Manual	Semi/Full automatic